| 摘要 |
Apparatus for heating printed circuit boards to melt solder overlay and, while solder overlay is in melted condition, orbiting the board rapidly in its plane to level solder on the interior sidewalls of the terminal holes. The circuit board is held on a planar member which is mounted by eccentric bearings on a shaft or shafts symmetrically disposed and driven in unison by timing pulleys and a timing belt. Preferably, a melted liquid bath is used to heat the circuit board, which is immersed in the bath then removed to cool. To facilitate loading and unloading, the circuit board is preferably mounted on a planar mounting member which is rotatable so that the circuit board is below the mounting member during the heating and solder leveling operation but which can be rotated so that the circuit board is above the planar mounting member for loading and unloading. Preferably also, the flexible shafts further include counterweights to balance the inertia of the circuit board and planar mounting member during its circular movement.
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