| 摘要 |
PURPOSE:To form a die pad for mounting an electronic component and a conductor circuit connected to the electronic component simultaneously of a metallic foil provided to one side of an insulating base material and to enable thinning of an entire by forming a die pad integrally at an end part of a supporting conductor which is formed by extending a part of a number of conductor circuits into a device hole. CONSTITUTION:A die pad 15 is hung by each supporting conductor 14 inside a device hole 12 by connecting an end of a number of supporting conductors 14 which are formed by extending a part of a number of conductor circuits 13 formed on an insulating base material 11 into a device hole 12 and four corner parts of the die pad 15 integrally. Each supporting conductor 14 and the die pad 15 are formed of the same metallic foil as other conductor circuit 13. After an electronic component 20 is mounted on the die pad 15, it is pressed into the device hole 12; then, each supporting conductor 14 slightly elongates or rotates, thereby making the die pad 15 position at the same place as a lower side of the insulating base material 11.
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