发明名称 SEMICONDUCTOR MANUFACTURING DEVICE
摘要 <p>PURPOSE:To make the moving locus of a forming member coincident with a prescribed aimed locus so that lead terminals can always be bent to accurate shapes and dimensions with a simple constitution by changing the position of a guide member which guides the movement of a forming member for making bending work to lead terminals. CONSTITUTION:After a semiconductor device 1 is placed on a bending die 3, a punch plate 4 is lowered and the device 1 is fixed onto the die 3 by means of the front end face 8a of a binder plate 8. When the plate 4 is further lowered, roller holders 40 are guided along the guide faces 60a of guide plates 60 through guide rollers 50 and a bending roller 7 bends a lead terminal 1a along the side face of the bending die 3 provided with a taper toward the center line C. During the course of this bending work, the moving locus of the bending roller 7 along the working face is compared with a prescribed aimed locus and the positions of the guide plates 60 are corrected by driving motors 64 so as to eliminate locus errors.</p>
申请公布号 JPH04111347(A) 申请公布日期 1992.04.13
申请号 JP19900228014 申请日期 1990.08.31
申请人 MITSUBISHI ELECTRIC CORP 发明人 ISHIHARA KAORU
分类号 H01L23/50;H05K13/00;H05K13/08 主分类号 H01L23/50
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