| 摘要 |
PURPOSE:To decide the outside dimension of a semiconductor device package from the size of a semiconductor chip used in the semiconductor device so as to improve the mounting efficiency by housing outer and inner leads in the length of the semiconductor chip. CONSTITUTION:After an insulating film 2 is stuck to an inner lead section 1A which is formed as if a tabless lead 1 is overturned with a bonding agent, a semiconductor chip 3 is stuck to the film 2 in the form of a pellet by using the main surface of the chip 3 as a sticking surface and the section 1A and the chip 3 are electrically connected with each other through bonding wires 4 after they are overturned. After connecting the section 1A and chip 3 with each other, they are sealed with a resin 5. All of the inner lead section 1A and an outer lead section 1B are housed in the length of the semiconductor chip 3 and this semiconductor device thus manufactured is formed to a pin- inserting ZIP type package. Therefore, the outside dimension of this semiconductor device 10 can be decided according to the size of the semiconductor chip 3. |
