<p>A print wiring (9) made of a metal or other conductive material is formed upon a ceramic substrate (5) by applying a photo etching or other process, the wiring (9) extending from a driving IC (2) to the edge of the ceramic substrate (5). An LED array chip (1) consisting of a light emitting part (10) and a bonding pad (8) is installed by applying a thermal pressing process or using a conductive adhesive so as for the light emitting part (10) to emit light to the outside of the substrate (5). A common electrode of the LED array chip (1) is connected to a proper position on the substrate (5). The invention reduces the number of the wire bonding to a great degree.</p>
