| 摘要 |
<p>PURPOSE:To connect chip elements to each other or to electrodes with shorter wires for preventing discontinuity or looseness of wires for stable connections by placing the electrodes between divided parts of a wafer and by installing pads near time cut end of each divided part of the wafer for wiring of the chip elements. CONSTITUTION:For guiding the cutting of a wafer with a dicer, a silicon- exposed scribe line 10 is created. Along the scribe line 10, the wafer is cut and divided into two parts. Near the cut end of each separated part of the wafer or on both sides of the scribe line 10, pads 11 are installed in the same number as the connections. When the wafer is mounted on a substrate in the divided condition, the separated parts 5a, 5b of the wafer are connected either by wire-bonding the pads 11 or through terminal leads on the substrate which are electrically isolated. When connecting the separated parts 5a, 5b of the wafer to the leads or patterns on the substrate, the connection is made by bonding between the pads 11 and the leads or patterns. Consequently, the chip elements on the separated parts of the wafer are connected more stably.</p> |
