发明名称 Power semiconductor package with semiconductor support - has metal core with insulated conductor track structures for semiconductor coupling
摘要 The package contains an integrated power semiconductor on a support, connectable via conductors, such as bond wires, to adjacent, surrounding contact points. The support is formed by a metal core (23) with insulated conductive track structures, with the power semi-conductor (22) directly secured to it. The semiconductor has an electric coupling to the conductive track structures (24,25,27,28) of the metal core. Pref. the semiconductor is directly glued to the metal core. The semiconductor may be coupled to the conductor track structures (24,27) by bond wires (26), with the structures leading to external, bondable contacts. USE/ADVANTAGE - For hybrid circuits. Suitable for high temp. regions.
申请公布号 DE4031814(A1) 申请公布日期 1992.04.09
申请号 DE19904031814 申请日期 1990.10.08
申请人 ROBERT BOSCH GMBH, 7000 STUTTGART, DE 发明人 ROETHLINGSHOEFER, WALTER, DIPL.-ING.;GOEBEL, ULRICH, DR., 7410 REUTLINGEN, DE;HUBER, ELMAR, 7401 PLIEZHAUSEN, DE
分类号 H01L23/14;H01L23/538;H01L25/16 主分类号 H01L23/14
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