| 摘要 |
PURPOSE:To improve the accuracy of mounting a chip part by moving the suction nozzle attracting a part to a position that is the same in height as a position of mounting the part to a printed circuit board, followed by using a recognition camera to recognizing the part at that position. CONSTITUTION:A part 7 taken out by suction by a nozzle 19 from a part supply section 6 is transferred by moving a mounting head 12, followed by using a recognition camera to recognize the part for position, attitude, lead bend, lead rise, and so on. Letting the height of the upper surface of a printed circuit board 10 to which the part 7 is to be mounted by a X-table section 3 be the part mounting level and the focal length of camera 71 be 'L2', each camera 71 is installed at a position lower by a focal length of 'L2' than the part mounting level, or when part 7 stops above the camera 71, if the height of the position of the lower surface of part 7 is at the part mounting level, the focus of camera 71 conforms with the lower surface of part 7, enabling camera 71 to pick up the image of part 7. As a result of recognizing part 7 using cameras 71, if it is found that there is a dislocation of part 7, both the mounting head 12 and the X-table 81 move by a distance equal to an amount of correction done for the dislocation. |
