PACKAGING METHOD OF ELECTRONIC PARTS

摘要

PURPOSE:To enable one part of traveling distance of a substrate in XY directions to be taken care of by that of a nozzle and electronic parts to be packaged at high speed by allowing the multi-nozzle type transfer head to be rotated by theta. CONSTITUTION:When mounting electronic parts P2 which are sucked to a nozzle 11a, a motor 3 is driven and a transfer head 2 is rotated by 180 deg.theta. Then the nozzle 11a moves by a distance d which is a rotary diameter of the nozzle 11a in Y direction. Therefore, one part of a traveling distance Y from coordinates a to coordinates b is taken care of by traveling of the nozzle 11a and the substrate 8 may be moved by only Y1-d and the traveling distance of the substrate 8 can be reduced, thus enabling time required for moving the substrate 8 to be reduced and packaging speed of electronic parts P2 to be increased. This transfer head 2 can be rotated by theta while the nozzle 11a takes up the electronic parts and mounts them to the substrate 8.