| 摘要 |
PURPOSE:To thin the package of a semiconductor device and to upgrade the molding performance of the package by using the second sealing process to install thin insulating sealing resin the side opposite to the semiconductor element loading surface. CONSTITUTION:Between the lower die 10 and the upper die 11, a semiconductor element 15 is mounted, and a lead frame 12 connected with wire 16 is set. Next, in the first sealing process, while drawing an island 13 of the frame 12 by vacuum suction and attracting the lower side of the island 13 to the flat surface of the lower die 10, thermal hardening mold resin (sealing material) 18 is injected to mold a sealing product without causing floating and inclination of the island 13. Next, in the second sealing process, insert the rear of product 17 between the lower die 20 and the upper die 21 taking the rear of product 17 upside and infect sealer in the rear of product 17 to mold thin plate insulating resin 23 on the rear of product 17. With this, the semiconductor device can be thinned and its molding performance can be upgraded.
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