发明名称 HEAT-RESISTANT FILM
摘要 PURPOSE:To make it possible to manufacture heat-resistant film having superb mechanical/chemical properties(mainly hydroscopic properties) and high economics by blending para-oriented rigid aromatic polyamide A, pliable aromatic polyamide B and soluble resin at a specific ratio. CONSTITUTION:The subject film consists of a blended resin of para-oriented rigid aromatic polyamide A, pliable aromatic polyamide B and soluble resin. The total amount of aromatic polyamides A, B is within a range of 5wt.% to 90wt.% of the total blended resin in film. In addition, the content of para- oriented rigid polyamide A is within a range of 10wt.% to 90wt.% of the total amount of aromatic polyamides A, B. In addition, the thermal size change factor at 250 deg.C of the film at least under one-direction lead (0.5kg/cm<2>) is 50% or lower.
申请公布号 JPH04107126(A) 申请公布日期 1992.04.08
申请号 JP19900227354 申请日期 1990.08.28
申请人 TORAY IND INC 发明人 OWADA JUN;NAKAWA TAKAHIRO;ITO NOBUAKI
分类号 C08J5/18;B29C55/02;B29K77/00;B29L7/00;C08L77/10 主分类号 C08J5/18
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