| 摘要 |
<p>PURPOSE:To form an IC card which can be extremely simply assembled and prevent a semiconductor element from being electrostatically damaged by having conductivity in a frame, and electrically connecting the ground pattern of a printed board to a protective cover through the frame. CONSTITUTION:A protrusion 21a protruding perpendicularly to an inside from the inside and a slit hole 21b formed on an end face perpendicular to the inside are provided in a frame 21, and when a printed board 11 is mounted in the frame 21, a ground pattern 11a provided on the peripheral edge of the board 11 is reliably brought into contact with the frame 21. An engaging pawl 14a of a protective cover 14 is inserted into the slit hole 21b when the cover 14 is engaged with the frame 21. Thus, when the board 11 is mounted in the frame 21, the pawl 14a is inserted into the hole 21a and the cover 14 is engaged with the frame 21, the pattern 11a of the board 11 is electrically connected to the cover 14 through the frame 21.</p> |
