| 摘要 |
<p>PURPOSE:To obtain an IC card which is increased in semiconductor IC mounting area and reduced in thickness by providing a wiring board with a semiconductor IC mounted on the board and such a paper battery that its anode and cathode layers are respectively coated with insulating films and the battery is stuck to the upper surface of the semiconductor IC by means of an adhesive layer coating one of the insulating films to the IC card. CONSTITUTION:This IC card is provided at least with a wiring board 3 with a semiconductor IC 2 mounted on the board 3 and prescribed wiring formed on the mounting surface 3a of the board 3 and such a paper battery 4 that its anode and cathode layers 4a and 4b are coated with insulating films 4c and the battery 4 is stuck to the upper surface of the IC 2 by means of an adhesive layer 5 coating one of the films 4c and an anode and cathode terminals 6 and 7 connected to the wiring on the surface 3a are formed at the end section of the surface 3a. In addition, the first conductor tongue 8 for connecting the layer 4a with the terminal 6 and second conductor tongue 9 for connecting the layer 4b with the terminal 7 are protruded toward the board 3 from the battery 4 coating the surface 3a. In order to prevent the contact between the layer 4b and the tongue 9 and layer 4a, for example, the end section of the battery 4 facing the tongue 9 is coated with an insulating film 10.</p> |
