| 摘要 |
PURPOSE:To make the title board superior in soldering temperature resistance, etching resistance, fire retardance and dimensional stability and moreover, to make it possible to manufacture the board at low cost by a method wherein a glass fiber nonwoven fabric, which is impregnated with an adherent resin composition containing an ethylene-ethyl acryrate copolymer resin obtainable by grafting alkoxysilane and a polyfunctional compound having a plurality of unsaturated bonds in its molecules as its main components, is crosslinked. CONSTITUTION:Triallyl isocyanurate, decabromodiphenyl ether, antimony trioxide, zinc borate and the like are dry-blended with a pellet of graft silane, and ethylene-ethyl acryrate copolymer resin obtainable by grafting alkoxysilane. The mixture is put in a biaxial kneading extruder, kneaded and extruded, and then, put in a T-die extruder and a filmy material of an adherent resin composition is obtained. The filmy material is pinched between the side of the roughened surface of an electrolytic copper foil and a glass fiber nonwoven fabric and a thermocompression bonding is performed to obtain a lamianted material. Then, a striped conductor circuit is formed on the electrolytic copper foil surface of a substrate and a flexible printed-wiring board is obtained. |
