发明名称 METHOD FOR MANUFACTURING A SEMICONDUCTOR CARD WITH ELECTRICAL CONTACTS ON BOTH FACES
摘要 Two superimposed series of electric contacts in the shape of metal-sheet strips, electrically connected to a metallic plate which supports a semiconductor chip, are electrically separated but mechanically connected by an interposed layer of insulating adhesive material. The whole is completely inserted in a covering of insulating material, which forms a flat support, from which, at opposite faces, only limited ajdacent contact portions of the electric contacts emerge. The place and at least one of the two series of contacts are part of a single starting metallic frame, on which the second series of contacts is superimposed. The latter series of contacts can be part of the same metallic frame as the first series in which case the device is formed by a folding operation. Alternatively the second series can be prepared separately and then applied on the first series.
申请公布号 US5102828(A) 申请公布日期 1992.04.07
申请号 US19890340696 申请日期 1989.04.20
申请人 SGS-ATES COMPONENTI ELETTRONICI S.P.A. 发明人 MARCHISI, GIUSEPPE
分类号 G06K19/077;H01L23/31;H01L23/495;H01L23/498 主分类号 G06K19/077
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