| 摘要 |
A semiconductor chip with a gauge pressure sensor section and an absolute pressure sensor section is anodically bonded, in a vacuum, to a glass mount with an evacuated space between the absolute-pressure sensor section and the mated surface portion of the glass mount. The pressure to be measured is received by the reverse surface of the gauge pressure sensor section. Since no complicated package is mounted within the outer package, the assembly of the sensor is easy. Further, since the pressure sensor has two sensor sections, namely, the gauge pressure sensor section and the absolute pressure sensor section, the sensor can be used as an absolute pressure sensor of the reverse-surface pressure-receiving type.
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