PACKAGE SEALING METHOD AND SEMICONDUCTOR DEVICE,申请号JP19900221915-传众专利搜索

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发明名称	PACKAGE SEALING METHOD AND SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH04103149(A)	申请公布日期	1992.04.06
申请号	JP19900221915	申请日期	1990.08.23
申请人	HITACHI LTD;HITACHI VLSI ENG CORP	发明人	AKASAKI HIROSHI;OTSUKA KANJI
分类号	H01L23/02	主分类号	H01L23/02
代理机构		代理人
主权项
地址

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