发明名称 MANUFACTURE OF METAL PLATED THERMOPLASTIC RESIN LAYERED BOARD
摘要 <p>PURPOSE:To obtain a layered board having small thermal expansion, good dimensional stability, proper dielectric constant and low dielectric loss tangent by superposing a plurality of prepregs impregnated with thermoplastic resins on a porous ceramic sheet and applying a metal foil to the outer surface of said prepregs by application of heat and pressure thereto. CONSTITUTION:A porous sheet of barium titanate having voids of 10% and pore of 1mum in diameter is impregnated with dispersion of PTFE(ethylene tetrafluoride), which is burnt at 400 deg.C to prepare a prepreg of fluorine resin. Eight sheets of said prepreg are laminated and a copper foil is superposed on both surfaces thereof to form a layered board, which is heated at 80 deg.C and compressed under pressure of 40kg/cm<2> to form a metal plated layered board in the form of one-piece body. Since the prepreg comprises a porous ceramic sheet impregnated with thermoplastic resin, inorganic particles are uniformly distributed over said sheet, resulting thereby in improved dimensional stability of said sheet. Further, the thermal expansion of said sheet is made smaller to achieve good dimensional stability. And furthermore, by selecting the kind of ceramic particles, dielectric constant can be adjusted.</p>
申请公布号 JPH04103349(A) 申请公布日期 1992.04.06
申请号 JP19900221705 申请日期 1990.08.23
申请人 HITACHI CHEM CO LTD 发明人 NEGISHI HARUMI;TERAMOTO NAOKI
分类号 B32B5/18;B29C43/20;B32B7/02;B32B15/08;B32B18/00;B32B37/00;H05K1/03 主分类号 B32B5/18
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