| 摘要 |
PURPOSE:To prevent the occurrence of cracks on a board and obtain a low- resistance pin by providing Kovar with the thermal expansion coefficient near to that of the ceramic multi-layer wiring board on the header section of a pin main body, and using a copper allay for the pin main body. CONSTITUTION:The header section 2 of a plate material of Kovar with the thermal expansion coefficient near to that of a board 5 is provided between the board 5 and the brazing section of a pin main body 1 made of a copper alloy. The stress of the brazing section is mitigated, and the occurrence of cracks on the substrate 5 is prevented. |
