发明名称 POLISHING MATERIAL
摘要 PURPOSE:To enhance the adhesion, efficiency and uniformity of treatment of the coating by providing the grinds of a thermosetting resin mold 5-100 mesh in particle size. CONSTITUTION:The polishing material is composed of the grinds of 5-100 mesh in particle size of a thermosetting resin mold. The adhesion to the metal surface prior to coating is thus improved and the peeling off of coated film is facilitated.
申请公布号 JPH04101776(A) 申请公布日期 1992.04.03
申请号 JP19900215464 申请日期 1990.08.15
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KONDO KENKICHI
分类号 B24C11/00;C08J5/14;C08L61/20;C08L61/22;C09K3/14 主分类号 B24C11/00
代理机构 代理人
主权项
地址