REFLOW SOLDERING METHOD OF ELECTRONIC PART,申请号JP19900219111-传众专利搜索

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发明名称	REFLOW SOLDERING METHOD OF ELECTRONIC PART
摘要
申请公布号	JPH04102393(A)	申请公布日期	1992.04.03
申请号	JP19900219111	申请日期	1990.08.22
申请人	FUJITSU LTD	发明人	SAKUYAMA SEIKI;WATANABE ISAO;SATO TAKEHIKO
分类号	B23K1/015;H05K3/34	主分类号	B23K1/015
代理机构		代理人
主权项
地址

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