| 摘要 |
PURPOSE:To improve yield of a thin film multilayer substrate adapted for mounting in high density in a small quantity production by inspecting a defect in comparison of wiring pattern information of an uppermost layer with correct pattern information each time a wiring pattern is formed, and correctly correcting a defective part based on position information of a defective pattern. CONSTITUTION:The entire surface of a substrate 110 is scanned by a spot light 501b by a laser source 501, a scanning mirror 506, etc., and a wiring pattern on an uppermost layer insulating film is visualized. Scattered light of a reflected light from the substrate 110 is collected by an integrating sphere 509, converted by a detector 510a, and a normally reflected light is converted by a detector 510b to electric signals. Both the signals are added by an adder 514, and sent to a wiring pattern shape inspecting processor 515. It is compared with a corresponding reference pattern in a memory by the processor 515 to detect a pattern defect, the detect is corrected, and yield of a thin film multilayer substrate adapted for mounting in a high density in a large quantity production is enhanced. |
