PROCEDE DE REALISATION D'UN MODULE HYBRIDE.

摘要

The invention concerns hybrid modules in which a plurality of integrated circuit chips (20) are housed in cells (18) hollowed in a slice of silicon (10). According to this method, a network of interconnections (13) for the chips (20) is first formed on one face of the substrate (10): it comprises at least one layer of polymer. Then the cells (18) are etched from the other face of the substrate (10) until they meet the network of interconnections (13). The chips are placed in the cells (18) and interconnected (26).