| 摘要 |
PURPOSE:To contrive the improvement of the resin sealing efficiency of resin- sealed package and a reduction in the manufacturing cost of a semiconductor device by a method wherein a notch part is formed in one part of a guard ring in such a way as to penetrate the inside and outside of the guard ring and a resin injection path trace is formed on this notch part in such a way as to connect from the outside of the ring to the package. CONSTITUTION:A resin-sealed package 15 on the inner side of a guard ring 16 can be molded with resin separately from a resin molding of the guard ring by a gate penetrating a notch part 18 in the guard ring. Accordingly, as the package 15 can be molded with resin separately from the resin molding of the ring 16, the resin sealing efficiency of the package 15 can be improved according to the desire. Moreover, as the package 15 and the ring 16 can be molded with resin in a simultaneous proceeding manner using the same molding device, an increase in the manufacturing cost of a semiconductor device can be inhibited.
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