MANUFACTURE OF LIGHT EMITTING DIODE DEVICE

摘要

PURPOSE:To control dicing size accuracy well within + or -0.1mm by connecting and cutting two tops of hexagonal through-holes arranged successively lengthwise and breadthwise on a substrate one by one. CONSTITUTION:A plurality of recessed parts 2 which are arranged lengthwise and breadthwise in pairs parallel to a highly heat resistant resin substrate 1 and a hexagonal through-hole 3 are formed. An end part of a first metallic layer 4 is provided to a bottom of the recessed part 2 and extends as far as a rear 7 passing through a top surface of the substrate 1 and the hole 3; extension direction thereof is toward a central direction. An end part 9 of a second metallic layer 8 is provided to a bottom of the recessed part 2 apart from the end part 5, passes through the top surface 6 and the hole 3 and extends as far as the rear 7; extension direction thereof is opposite to the first metallic layer 4. A size of the hole 3 is (a) of 1.8mm and (b) of 0.8mm. An LED 10 is fused on the end part 5. Dicing is carried out as A1A2A3... breadthwise and B1B2B3B4... lengthwise in transverse direction of the substrate 1 using two tops of the hexagonal holes 3 parallel to one side of the recessed part 2 as a marker one by one and a device 13 is completed.