| 摘要 |
PURPOSE:To unnecessitate redundant blocks and effectively use the whole part of a wafer, by arranging a bump forming region in a block, in order to bond a relief chip used for relieving a generated imperfect block on an imperfect block by using bumps. CONSTITUTION:Blocks 4 are formed around an imperfect block 6 on a wafer 2, via a wiring part 14. A circuit 10 inside the imperfect block 6 is connected with wirings in the wiring part 14, via solder bumps 12. Thereby said circuit 10 is connected with circuits in other blocks 4. Wirings connecting the circuit 10 and the solder bumps 12 are equipped with laser cut parts 16, and the wirings are cut off by projecting a laser light, thereby electrically separating the imperfect block 6. After a relief chip 8 equipped with solder bumps is mounted on the imperfect block 6, the relief chip 8 is subjected to flip chip bonding on the imperfect block 6 by heating. |
