PACKAGING METHOD FOR SEMICONDUCTOR DEVICE,申请号JP19900219789-传众专利搜索

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发明名称	PACKAGING METHOD FOR SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH04101446(A)	申请公布日期	1992.04.02
申请号	JP19900219789	申请日期	1990.08.21
申请人	SEIKO INSTR INC	发明人	AIDA MASANORI
分类号	H01L21/301;H01L21/02;H01L21/78;H01L23/28	主分类号	H01L21/301
代理机构		代理人
主权项
地址

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