| 摘要 |
PURPOSE:To improve the quality of soldering by turning the surface of plating under a specific oxidizing state and providing the properties of an organic film which can be removed cleaning with an organic solvent or decomposed at a specific temperature in terms of nickel or nickel alloy plating where copper or copper alloy is applied. CONSTITUTION:The surface oxidizing state of nickel or nickel alloy plating to which copper or copper alloy is applied, indicates that the ratio between the oxygen peak intensity of an X-ray photoelectron analytical value and nickel peak (O1s)/(Ni2p) is 1 or below. It is also provided with the properties of an organic film which can be removed by cleaning with an organic solvent or composed at a temperature of 300 deg.C and below. The thickness of the organic film is specified to be 0.01mum or over and 0.1mum or below. The surface tension of the organic film is property 20 deg. or below at a contact angle with press oil. This construction makes it possible to obtain a material which indicates excellent soldering properties after long time storage and enhance the quality and reliability of products as well. |
