Covering process for semiconductor chip - in which curable plastic is spread by gas stream

摘要

In covering a semiconductor chip (3) with contact wires (5), a curable plastic is applied in gel form as a drop (1') onto the middle of the chip. The drop is then spread and formed in a stream of air, Ar or N2 (2) from a nozzle (6) divided into a grid of holes, e.g. 0.5 mm diameter and 0.3mm long. UV light can be directed from either side of the nozzle to cure the plastic. Several chips can also be simultaneously covered.