Integrated circuit device and method to prevent cracking during surface mount.

摘要

A lead over chip packaged device that is less prone to package cracking during surface mounting is disclosed. The lead over chip lead frame (25) overlies the active face of a semiconductor circuit (21). The backside of the semiconductor circuit is covered with an aminopropyltriethoxysilane coating (21a). The aminopropyltriethoxysilane coating (21a) promotes adhesion between the backside of the semiconductor circuit (21) and the mold compound (26) used to encapsulate the device. This reduces package cracking resulting from delamination between the inactive face of the chip and the mold compound during reflow solder.