| 摘要 |
A multiple layer semiconductor circuit module includes a semiconductor substrate including opposed first and second surfaces and side walls; a first circuit disposed on the first surface of the substrate including a plurality of conductors, at least one of the conductors extending on the first surface of the substrate to one of the side walls; a first electrically insulating layer disposed on the first surface of the substrate, covering the first circuit, and including a second surface adjacent to the first surface of the substrate, an opposed first surface, and side walls; a second circuit disposed on the first surface of the first layer including a plurality of conductors, at least one of the conductors extending on the first surface of the first layer to one of the side walls; a second electrically insulating layer disposed on the first surface of the first layer, covering the second circuit, and including a second surface adjacent to the first surface of the first layer, an opposed first surface, and side walls; a third circuit disposed on the first surface of the second layer including a plurality of conductors, at least one of the conductors extending on the first surface of the second layer to one of the side walls; and at least one electrical conductor disposed on at least one of the side walls of the substrate and the first and second insulating layers electrically interconnecting the first, second, and third circuits. |
