| 发明名称 |
MODULAR RESIN-ENCAPSULATED MULTI-CHIP CIRCUIT PACKAGE AND ITS MANUFACTURING METHOD |
| 摘要 |
The circuit comprises several metal plates (A,B,C) onto each of which a chip (D,E,F) is soldered, the chips being connected together and to their respective rheophores (1,2.....9) by means of bonding wires. The plates and the other internal electrical components are reciprocally insulated by means of the resin which constitutes the encapsulation. |
| 申请公布号 |
EP0292059(B1) |
申请公布日期 |
1992.04.01 |
| 申请号 |
EP19880200961 |
申请日期 |
1988.05.13 |
| 申请人 |
SGS-THOMSON MICROELECTRONICS S.R.L. |
发明人 |
PALARA, SERGIO;PERNICIARO SPATRISANO, ANTONIO;PAPARO, MARIO;GIACALONE, PIETRO |
| 分类号 |
H01L23/28;H01L21/56;H01L23/495;H01L23/52;H01L25/04;H01L25/07;H01L25/18 |
主分类号 |
H01L23/28 |
| 代理机构 |
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