| 摘要 |
<p>PURPOSE:To enable accurate evaluation of all internal elements in an integrated circuit chip by actually measuring some transistors in the chip through their direct connections to bonding pads. CONSTITUTION:A semiconductor chip 1 includes an inner region 2 in its central area, where many MOS transistor cells 20 are arranged in rows. There are arranged many input/output buffers 3 and bonding pads 4 in the periphery of the chip. A probe is brought into contact with bonding pads 41-43 and 44-46 to turn transistor cells 21 and 22 on for the purpose of measuring characteristics of the transistors. This enables accurate evaluation of the other transistor cells that should have the same characteristics as the actually measured transistors.</p> |
