发明名称 CHEOMICAL VAPOUR DEPOSITION PROCESS OF A TIN BY A PLASMA
摘要 In methods for TiN film by glow discharge of reactive gases such as TiCl4, N2 and H2 and carrier gas of Ar with radio frequency generator, it is characterized by inserting heating wire and thermocouple to substrate and deposition temperature, ratio of TiCl4 to N2 and working gas pressure are 450-530 deg.C, 1/20-1/25 and 2-3 torr, respectively. It has advantages of lowering rection temperature from 1000 deg.C to about 500 deg.C, increasing mass productivity, enhancing uniformity of film thickness in complex shaped substrate. Especially, tempering process for making tools can be substituted for heating during CVD process, so it is possible to omit heat treatment process after coating.
申请公布号 KR920002708(B1) 申请公布日期 1992.03.31
申请号 KR19900003896 申请日期 1990.03.22
申请人 KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 CHUN, SUNG - SOON;KIM, SI - BUM;CHANG, DONG - HOON
分类号 C23C16/50;(IPC1-7):C23C16/50 主分类号 C23C16/50
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