发明名称 |
Method of manufacturing a printed circuit board |
摘要 |
A method of manufacturing a printed circuit board for use in an electronic circuit is disclosed. The method comprises steps of forming a printed circuit on an insulating base board, of forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and of adhering the conductive ink through an uneven surface formed on a terminal portion to be connected to the printed circuit.
|
申请公布号 |
US5100695(A) |
申请公布日期 |
1992.03.31 |
申请号 |
US19890445744 |
申请日期 |
1989.11.29 |
申请人 |
NIPPON CMK CORP. |
发明人 |
KAWAKAMI, SHIN;HARUYAMA, SATOSHI;OKONOGI, HIROTAKA |
分类号 |
H05K1/02;H05K1/09;H05K3/24;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|