发明名称 Method of manufacturing a printed circuit board
摘要 A method of manufacturing a printed circuit board for use in an electronic circuit is disclosed. The method comprises steps of forming a printed circuit on an insulating base board, of forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and of adhering the conductive ink through an uneven surface formed on a terminal portion to be connected to the printed circuit.
申请公布号 US5100695(A) 申请公布日期 1992.03.31
申请号 US19890445744 申请日期 1989.11.29
申请人 NIPPON CMK CORP. 发明人 KAWAKAMI, SHIN;HARUYAMA, SATOSHI;OKONOGI, HIROTAKA
分类号 H05K1/02;H05K1/09;H05K3/24;H05K3/46 主分类号 H05K1/02
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