| 摘要 |
PURPOSE:To scarcely generate a crack of a package and to improve reliability of the package by chamfering the side of a die pad, and dispersing a thermal stress generated in the package. CONSTITUTION:A die pad is secured in resin by sealing resin (epoxy resin). The upper and lower parts of the side of the pad are chamfered 4. A thermal stress generated in a package is suitably dispersed by the chamfering to eliminate a crack. The size of the chamfering is desirably larger at the lower part than that at the upper part of the side of the pad. The reason is because, if the chamfering of the lower part is larger than that of the upper part, the stress is concentrated at the upper part so that a crack of the package easily occurs at the upper part and there is a danger of disconnection of a gold wire. |
