| 摘要 |
PCT No. PCT/FR89/00561 Sec. 371 Date Sep. 4, 1990 Sec. 102(e) Date Sep. 4, 1990 PCT Filed Oct. 27, 1989 PCT Pub. No. WO90/05053 PCT Pub. Date May 17, 1990.Abrasion-type splitting unit for splitting an ingot composed of hard material into a plurality of wafers. The unit includes two identical, horizontal and parallel wire guide cylinders arranged facing one another, and turning synchronously, a wire which unwinds from a supply coil and is then wound under tension around the wire guides to form at least one set of cutting wires before being reengaged by a take-up coil, and an actuator operating according to a vertical axis passing through the center of gravity of an ingot in order to lift a bracket carrying the ingot, and press the ingot against the cutting wires. In particular, the unit includes a supporting structure having a single component, which is symmetrical to the median vertical plane, and perpendicular to the wire guides. Additionally, the supporting structure includes two upper lateral flanges which carry on both sides the wire guides, with the bracket having guide members interacting with rails on the supporting structure.
|
