Microchannel heat sink with alternating flow directions

摘要

A microchannel heat sink with coolant flowing in alternate directions in adjacent channels. The microchannel heat sink is used for cooling the electronic device making thermal contact with the surface of the heat sink. The alternate directions of the coolant flow eliminate temperature variation along the channel length caused by the heating of the coolant. This new "alternating channel flow" heat sink design achieves a nearly uniform temperature and thermal resistance on the surface of the heat sink and effectively cools the electronic device in contact.