Open bond detector for an integrated circuit

摘要

An open bond detection circuit is provided for verifying the continuity through a bonding wire connected between an external pin and a bonding pad of an integrated circuit by monitoring the potential developed across a metal conductor connected between the bonding pad and the power supply conductor. An output signal is provided having a first state upon detecting substantially zero potential difference across the metal conductor and a second state when detecting a non-zero potential difference across the metal conductor. The first state of the output signal with substantially zero potential difference reflects an open bond between the external pin and bonding pad, while the second state of the output signal with non-zero potential difference indicates the bonding wire is intact.