| 摘要 |
A wafer spinning assembly for use in wafer processing includes a chuck for holding a wafer, a vertically oriented spindle connected to drive the chuck, and a spindle drive motor. The spindle drive motor includes an enclosed cylindrical housing which is enclosed on a top end with a top end cap having an outside surface impermeable to infiltration by wafer processing solutions. A drive shaft is mounted inside the housing for rotational movement and out an unsealed aperture in the top end cap. A motor mounted inside the housing provides electromotive rotational force to the shaft in response to electric power supplied to the motor through a plurality of brush assemblies. The top end cap includes a cylindrical collar portion extending outwardly from the outside surface, oriented generally horizontally, of the top end cap and around the shaft. The motor is deployed so that the shaft is actually aligned with the spindle. A spindle coupler on an end of the shaft couples the shaft to the spindle, caps the end of the shaft and has a cylindrical hood portion having an inside diameter greater than the outside diameter of the collar. The shaft and the coupler are sized so that the hood portion surrounds the collar to prevent wafer processing solutions from entering the housing through the unsealed shaft aperture. The collar portion extends outwardly enough to prevent wafer processing solutions from draining into the housing through the shaft aperture.
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