| 摘要 |
A connector for mounting an i.c. unit on a circuit board is made by providing an electrically insulating, thermoplastic body with a plurality of apertures arranged in a pattern and with contact members disposed in the apertures so that terminal portions of the members extend from the apertures at one side of the body. A heated tool having hollow cylindrical portions spaced in the same pattern at one side of the tool is advanced to accommodate the extending terminal portions of the contact members in the hollow portions of the tool and to engage ends of the hollow cylindrical tool portions with individual parts of the body surrounding the respective apertures. The heated tool portions are held in engagement with the thermoplastic body for a selected dwell time to heat limited portions of the body material abutting the apertures to a glass transition temperature of the body material less than the material melting temperature; are then pressed against the body to penetrate the heated body material portions to displace heated material into the individual apertures against the contact members; and are then withdrawn to permit the displaced material to cool to secure and preferably to seal the contact members in selected positions in the body apertures.
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