| 摘要 |
<p>PURPOSE:To prevent distortion or burrs even if there if difference in the dimensions after the deformation caused by thermal expansion regarding boards and jig plates by boring elliptic guide slots in the printed boards, aligning them on the center lines of both X and Y axes. CONSTITUTION:In a printed wiring board 1A, where wiring is applied in advance, and an insulating adhesive 1B, elliptic guide slots 9 and, at the centers, round holes 10 are bored on the center lines of X axis and Y axis. Columnar guide pins 7 are installed in advance, at the same position as the guide slots bored in the printed wiring boards, etc., in a lower bonding jig plate 3. Furthermore, guide pins 5 for the positioning of these lower bonding jig plate 3 and upper bonding jig plate 2 are installed in advance at the four corners. In the upper jig plate 2, which is combined with the lower bonding jig plate 3, guide holes 8 and 6, which set on the guide pins 7 for restricting the printed wiring boards, etc., and guide pines 5 for positioning the lower jig, are bored in advance. If both the X axis and the Y axis are restricted with the guide pins, the 'deviation' under the wiring board face of the laminate and between the upper and lower jig plates does not occur.</p> |
