| 摘要 |
PURPOSE:To decrease the wiring resistance and get a board without defects such as deformation, etc., by leveling the surface of a conductive pattern with the surface of a ceramic crude sheet. CONSTITUTION:First, a circuit pattern 12 is made on an easy-exfoliative film 11 with conductive paste by screen printing, transcription, or the like. Next, a ceramic crude sheet 13 is made in the desired thickness so that it may cover the above circuit pattern by printing method or doctor blading method, thus a flat ceramic crude sheet is gotten, in which the pattern surface of a conductive circuit pattern and the ceramic layer surface are level. Then, this ceramic crude sheet 13 is bored, and conductive paste is filled in this hole to get a through hole 14. The surface and the rear of the ceramic crude sheet 13 obtained are inverted, and another ceramic crude sheet 15 is stacked thereon, and are heated and pressurized, and then it is baked to obtain a mutlilayer ceramic circuit board. |
