CIRCUIT MAKING METHOD FOR CERAMIC PRINTED CIRCUIT BOARD

摘要

In the ceramic electronic circuit, the substrate is formed with an aluminum nitride layer and a noble metal-aluminum layer, simultaneously, by inter-diffusion of aluminum and noble metal. The fabrication method for electronic circuit has the following processes; (1) forming an aluminum layer on the surface of ceramic substrate by vacuum evaporation or sputtering of aluminum; (2) spreading photoresist films on the surface of aluminum except on the electronic circuit part and forming noble metal layer on the electronic circuit part; (3) heat treating it in nitrogen atmosphere. It has advantages of increasing thermal conduction by aluminum nitride layer and reducing surface roughness of ceramic substrate by aluminum layer. The substrate is applicable to high integrated and functional circuit because it is possible to form a thin film and micro-fabricated circuit.