发明名称 METHOD OF FORMING OR TESTING PATTERN FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make it possible to form or test a pattern with high accuracy by exposing or testing the pattern after it is detected that a semiconductor substrate or a glass mask was heated to a certain temperature or temperature distribution. CONSTITUTION:A sample chamber 1 is equipped with a stocker 7 to stock a glass mask or a semiconductor wafer 4. An image is drawn to form a high- accuracy pattern after a measurement thermo-couple 8 is brought into contact with the glass mask, the semiconductor wafer, or a sample holder 4 under treatment by a robot arm 9 and the temperature thereof and the difference in temperature therebetween reach a certain level. A sample chamber 10 is equipped with a stocker 15 to stock treated glass masks 13 mounted on sample holders 12 and the temperatures thereof or the difference in temperature therebetween is measured with thermo-couples 17 fixed to robot arms 16. When the result of the measurement reaches a certain level, the treated glass masks 13 on the sample holders 12 in the stocker are selectively sent to a stage 11 for the specified pattern inspection.
申请公布号 JPH0496314(A) 申请公布日期 1992.03.27
申请号 JP19900214603 申请日期 1990.08.14
申请人 TOSHIBA CORP 发明人 HIGAKI TOMOTAKA
分类号 G03F7/20;H01L21/027;H01L21/30;H01L21/66 主分类号 G03F7/20
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