| 摘要 |
PURPOSE:To reduce size, weight and cost and to raise heat dissipating characteristic by securing a hollow vessel formed with a predetermined conductive pattern on a metal frame, securing a light emitting element and the end of an optical fiber in the vessel, and securing it at the part of a frame. CONSTITUTION:A ceramic vessel 2 formed of a first member 2a formed with an inner lead pattern 13 on its upper surface, second and third members 2b, 2c formed with outer lead patterns 15, 16 at its outside, and a cover, is secured on a metal frame 1, and a laser diode LD and the end 3a of an optical fiber 3 are secured on the frame 1 in the vessel 2 through first and second submounts 5, 6. Accordingly, a lead frame having an outer terminal is omitted, size, weight and cost are reduced, and heat dissipating characteristic of a package A is improved. Since a sheath 3b is secured by a securing belt 1a in the fiber 3, optical axis alignment of the diode LD and the fiber 3 can be accurately performed. |
