| 摘要 |
<p>PURPOSE:To make it possible not to leave unbending traces of a residual resin at the gate part of a frame case and a residual resin at the gate part of a resin sealing element on the surface by a method wherein when a residual resin at the gate part of frame case is unbent, the removed trace is generated at the outer corner part of the bottom part of a notch part, and the residual resin removed trace is closed by molding of the next resin sealing element. CONSTITUTION:When a residual resin lid is broken in the lifting direction, at the outer corner of the bottom part of a notch part 11c, a resin removed trace 11e just like being bitten in is generated. On the bottom of a recessed part 11b of a frame case 11 which is under this condition, a circuit substrate 1 on which a functional part such as a semi-conductor element package 2, etc., is installed is fixed. Then, in a second die which is matched with the contour of the frame case 11 and has a cavity to form a resin sealing element 12, the frame case 11 on which the circuit substrate 1 is fixed is placed in such a manner that the notch part 11c is located at the gate side of the second die. Then, a molding resin is injected in the cavity of the second die to mold the resin sealing element 12. The notch part 11c of the frame case 11 is closed by the resin sealing element 12.</p> |
