| 摘要 |
PURPOSE:To enhance the storage stability and the adhesion strength of an anisotropic conductive film over a wide temperature range and also enable the film connected to a microcircuit to be peeled through heating by mixing a nonreactive diluent into a reaction product of imidazole derivative and an epoxy compound. CONSTITUTION:In manufacturing an anisotropic conductive film of thermosetting type, the film is manufactured from a mixture including a reactive elastomer, an epoxy resin, a solvent for dissolving the elastomer and the resin, an imidazole derivative epoxy compound, a nonreactive diluent, and conductive particles. The film can thus be formed irrespective of the kind of the solvent by means of dissolving and mixing together film forming agent and other blended materials for providing the film with various performance. Also the film can be connected to a microcircuit in a short time and is particularly excellent in storage stability and adhesion strength over the wide temperature range (-30 to 100 deg.C) and, when connected to the microcircuit, it can be peeled therefrom by heating above predetermined temperature. |
