Piezoelectric elements are cut from wafer - by using diamond coated saw and sawing through wafer thickness in 3 patterns of parallel lines to give regular hexagonal elements

摘要

Piezoelectric elements are cut from a wafer (W) of pizeoceramic material which is attached to a carrier, pref. self adhesive plastic material, by making 3 patterns of parallel cuts (S) at a distance (s) from each other. The patterns make an angle of 60 degrees with each other (beta1, 2 and 3). The resulting individual piezoelectric elements have a regular hexagonal shape. The saw is pref. a diamond coated disk (D). USE/ADVANTAGE - The method is able to give a much higher yield of usable elements than current techniques. The individual elements can be easily separated using standard pick and place methods. The shape of the elements is close to that obtained with current ultrasonic cutting methods. The elements are used in the mfr. of printing heads to eject a drop of ink from a reservoir.