| 摘要 |
PURPOSE:To enable grinding to reduce irregularities of wafer thickness and to make the thickness uniform by setting a processing object in a round hole of a carrier for holding the processing object, by setting a thin board whose shape is the same as that of a cut-out part in the cut-out part whose round hole is not filled, and by grinding both sides. CONSTITUTION:For example, a thin board 6 having the same share as a cut-out part is set in the cut-out part formed for an OF line 5 of a wafer to fill a round hole and to eliminate a clearance of the cut-out part. Thereby, the wafer is uniformly pressurized by upper and lower surface plates and grinding powders hardly collect in the cut-out part, thereby enabling uniform grinding and realizing uniform thickness. The spacer 6 is formed of the same material as a carrier 2 such as epoxy resin and made to the same thickness as the carrier. Then, the round hole of the carrier is filled and a clearance is eliminated, a pressure is uniformly applied all over the carrier, and grinding powders does not collect. Further uniform grinding can be realized in this way. |
